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Wafer-Level Packaging

EMBEDDED IMAGE ENHANCEMENT

OPTICAL IMAGE ENHANCEMENT

WAFER-LEVEL OPTICS

成像和光学

CHIP SCALE PACKAGING

MULTI CHIP PACKAGING

FLIP CHIP PACKAGING

WAFER LEVEL PACKAGING

SEMICONDUCTOR PACKAGING

PACKAGE SUBSTRATE

FLIP CHIP SUBSTRATE

SUBSTRATE INTERCONNECT

THERMAL MANAGEMENT

FACILITIES AND CAPABILITIES

DIFFRACTIVE ELEMENTS

REFRACTIVE ELEMENTS

办事处地点

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ABOUT TESSERA

行政管理团队

NICHOLAS BRATHWAITE

BRUCE MCWILLIAMS

董事会



Robert Boehlke



Nicholas E. Brathwaite



John B. Goodrich



Al S. Joseph, PH.D.



Bruce M. McWilliams, PH.D.



David Nagel, PH.D.



Henry R. "Hank" Nothhaft



Robert A. Young, PH.D.