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Tessera 소개

Wafer-Level Packaging

EMBEDDED IMAGE ENHANCEMENT

OPTICAL IMAGE ENHANCEMENT

WAFER-LEVEL OPTICS

영상 및 광학

CHIP SCALE PACKAGING

MULTI CHIP PACKAGING

FLIP CHIP PACKAGING

WAFER LEVEL PACKAGING

SEMICONDUCTOR PACKAGING

PACKAGE SUBSTRATE

FLIP CHIP SUBSTRATE

SUBSTRATE INTERCONNECT

THERMAL MANAGEMENT

FACILITIES AND CAPABILITIES

마이크로 전자기술

DIFFRACTIVE ELEMENTS

REFRACTIVE ELEMENTS

마이크로 광학

단일-구성렌즈

사무소 위치

연락처

ABOUT TESSERA

NICHOLAS BRATHWAITE

BRUCE MCWILLIAMS

이사회



Robert Boehlke



Nicholas E. Brathwaite



John B. Goodrich



Al S. Joseph, PH.D.



Bruce M. McWilliams, PH.D.



David Nagel, PH.D.



Henry R. "Hank" Nothhaft



Robert A. Young, PH.D.