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Corporate Fact Sheet
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| Tessera Technologies, Inc., invests in, licenses and delivers innovative miniaturization technologies that transform next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tessera’s imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. |
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At A Glance:
- Company Founded:
- Revenue for FY 2009:
- Employees for FY 2009:
- Headquarters:
- Locations:
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1990
$299.4 million
415: 60% technologists, of which 20% have PhDs
3025 Orchard Parkway, San Jose, Calif. 95134
Sales, support and R&D offices worldwide in North America, Europe, Israel, Japan and Asia Pacific | |
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| Management Team: |
- Henry R. “Hank” Nothhaft, President, CEO and Chairman
- Michael Anthofer, Executive Vice President and CFO
- Robert Yung, Executive Vice President and CTO
- John Keating, Senior Vice President, Corporate Development
- Michael Bereziuk, Executive Vice President, Imaging & Optics
- Craig Mitchell, Senior Vice President, Interconnect, Components & Materials, Micro-electronics
- Brian Marcucci, Senior Vice President, Business Development & Licensing, Micro-electronics
- Bernard J. "Barney" Cassidy, Senior Vice President and General Counsel
- H. Thomas Blanco, Senior Vice President and Chief Administration Officer
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Solutions:
Tessera invests in, develops and delivers a comprehensive portfolio of technologies in: |
- Micro-electronics – semiconductor packaging technologies encompassing interconnect and substrates, and thermal management solutions, including:
- TCC (Tessera Compliant Chip®) technology
- µPILR™ interconnect platform
- µBGA® family of lead- and wire-bonded chip-scale packages (CSPs)
- µZ® Multi-Chip Package (MCP) technology
- Imaging and optics - wafer-level optics, wafer-level packaging and image enhancement technologies, and micro-optic solutions, including:
- OptiML™ wafer-level optics and optical image enhancement solutions
- FotoNation® embedded image enhancement solutions
- SHELLCASE® wafer-level, chip-scale packaging (WLCSP) technology for image sensors
- DigitalOptics™ diffractive and refractive optical elements and integrated multi-optical sub-assemblies
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