Corporate Fact Sheet Tessera Technologies, Inc., invests in, licenses and delivers innovative miniaturization technologies that transform next-generation electronic devices. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale, 3D and wafer-level packaging technology, as well as high-density substrate and silent air cooling technology. Tessera’s imaging and optics solutions provide low-cost, high-quality imaging functionality for wafer-level cameras, compact camera modules (CCM) and specialty optics systems, and include image enhancement technologies, wafer-level packaging and wafer-level optics. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. At A Glance: Company Founded: Revenue for FY 2009: Employees as of May 2010: Headquarters: Locations: 1990 $299.4 million 472: 60% technologists 3025 Orchard Parkway, San Jose, Calif. 95134 Sales, support and R&D offices worldwide in North America, Europe, Israel, Japan and Asia Pacific Management Team: Henry R. “Hank” Nothhaft, President, CEO and Chairman Michael Anthofer, Executive Vice President and CFO Robert Yung, Executive Vice President and CTO Michael Bereziuk, Executive Vice President, Imaging & Optics Bernard J. "Barney" Cassidy, Executive Vice President and General Counsel John Keating, Senior Vice President, Corporate Development H. Thomas Blanco, Senior Vice President and Chief Administration Officer Brian Marcucci, Senior Vice President, Business Development & Licensing, Micro-electronics Craig Mitchell, Senior Vice President, Interconnect, Components & Materials, Micro-electronics Liam Goudge, Senior Vice President and General Manager, Silent Air Cooling Technology Solutions: Tessera invests in, develops and delivers a comprehensive portfolio of technologies in: Micro-electronics – semiconductor packaging technologies encompassing interconnect and substrates, and thermal management solutions, including: TCC (Tessera Compliant Chip®) technology µPILR™ interconnect platform µBGA® family of lead- and wire-bonded chip-scale packages (CSPs) µZ® Multi-Chip Package (MCP) technology Imaging and optics - OptiML™ family of wafer-level camera, compact camera module (CCM) and specialty optics solutions: Image enhancement solutions, from software to silicon to optics Wafer-level technologies, ranging from wafer-level packaging to wafer-level optics Micro-optic solutions including diffractive optical elements (DOEs), refractive optical elements (ROEs) and integrated micro-optical subsystems (IMOS)