Corporate Fact Sheet Tessera Technologies, Inc., headquartered in San Jose, California, develops, invests in, licenses and delivers innovative miniaturization technologies and products for next-generation electronic devices. More than 65% of Tessera’s employees are dedicated technologists or inventors. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale and wafer-level packaging, silicon-level interconnect and 3D packaging, as well as silent air cooling technology. Tessera’s imaging and optics solutions provide cost-effective, high-quality camera functionality in consumer electronic products through technologies that include Extended Depth of Field (EDoF), zoom and MEMS-based auto-focus. The company also offers custom micro-optics for semiconductor lithography, communications, medical, industrial and other applications. For information call 1.408.321.6000. At A Glance: Company Founded: Revenue for FY 2010: Employees as of Feb 2011: Headquarters: Locations: 1990 $301.4 million 469: 65% technologists 3025 Orchard Parkway, San Jose, Calif. 95134 Sales, support and R&D offices worldwide in North America, Europe, Israel, Japan and Asia Pacific Management Team: Robert A. Young, President, CEO & Member of the Board Michael Anthofer, Executive Vice President and CFO Bernard J. "Barney" Cassidy, Executive Vice President and General Counsel Bob Roohparvar, President, DigitalOptics Corporation Richard Chernicoff, President, Intellectual Property and Micro-electronics Simon J. S. McElrea, President, Invensas Corporation Craig Mitchell, Senior Vice President Liam Goudge, Senior Vice President & General Manager Solutions: Tessera invests in, develops and delivers a comprehensive portfolio of technologies in: Micro-electronics – semiconductor packaging technologies encompassing interconnect and substrates, and thermal management solutions, including: TCC (Tessera Compliant Chip®) technology µPILR™ interconnect platform µBGA® family of lead- and wire-bonded chip-scale packages (CSPs) µZ® Multi-Chip Package (MCP) technology Imaging and optics - OptiML™ family of wafer-level camera, compact camera module (CCM) and specialty optics solutions: Image enhancement solutions, from software to silicon to optics Micro-optic solutions including diffractive optical elements (DOEs), refractive optical elements (ROEs) and integrated micro-optical subsystems (IMOS)