Tessera Technologies, Inc., headquartered in San Jose, California, develops, invests in, licenses and delivers innovative miniaturization technologies and products for next-generation electronic devices. More than 65% of Tessera’s employees are dedicated technologists or inventors. The company’s micro-electronics solutions enable smaller, higher-functionality devices through chip-scale and wafer-level packaging, silicon-level interconnect and 3D packaging, as well as silent air cooling technology. Tessera’s imaging and optics solutions provide cost-effective, high-quality camera functionality in consumer electronic products through technologies that include Extended Depth of Field (EDOF), zoom and MEMS-based auto-focus. The company also offers custom micro-optics for semiconductor lithography, communications, medical, industrial and other applications.
After being founded in 1990, Tessera became a leader in integrated circuit (IC) packaging with its transformational Tessera Compliant Chip® (TCC) chip-scale packaging (CSP) technology. This innovative technology, which has been widely adopted by the semiconductor industry, enables the packaging of an IC to be approximately the same size as the IC itself. The company continues to develop breakthrough solutions in this arena, most recently applying its unique expertise to 3D packaging, high-density substrates and silent air cooling technology.
In 2005, Tessera expanded on its packaging expertise by investing in wafer-level CSP solutions for image sensors. Over the last six years, Tessera has made a series of strategic acquisitions and advancements, furthering its position in the imaging and optics markets.