Milestones 2011 Invensas acquires ALLVIA 3D-IC packaging technology DigitalOptics partners with Celluon on virtual keyboard NANIUM produces high density, high speed DRAMs with Invensas’ xFD technology Invensas unveils new multi-die face-down (xFD) packaging technology DigitalOptics technology in space shuttle Endeavour mission Tessera Creates New Invensas™ and DigitalOptics™ Groups Tessera Licenses OptiML™ Zoom Solution to Samsung SEMI Recognizes Developers of Tessera Chip-Scale Packaging Technology Tessera Licenses Patents to Olympus Imaging Tessera Licenses New Video Tools Solution to Fujitsu Semiconductor 2010 Fujitsu renews technology licensing agreement with Tessera New Tessera technology brings video image stabilization to mobile market Tessera acquires Siimpel Tessera licenses Face Tracking technology to Samsung Tessera licenses OptiML Focus technology to AzureWave Tessera and UTAC sign updated technology licensing agreement Tessera and Nanium sign packaging technology agreement Tessera® OptiML image enhancement technologies in Samsung HD image sensors Tessera licenses Face Tracking technology to SK Telesys Tessera licenses OptiML Micro Via Pad technology to JCAP Tessera ships one millionth OptiML lens 2009 New Tessera FotoNation® technology enables face recognition for mobile devices Tessera developing 3 MP wafer-level optics (WLO) technology with EDOF Tessera and Motorola enter into technology license agreement Tessera acquires certain assets from Dblur Tessera® OptiML™ image enhancement solutions for up to 14 MP Tessera offers DigitalOptics™ lens array technology for parallel optics Tessera licenses wafer-level optics (WLO) to Qtech Tessera licenses µPILR™ technology to Kinsus 2008 Tessera's OptiML wafer-level camera technology recognized for photonics innovation Tessera’s wafer-level packaging technology shipped in one billion image sensors Tessera introduces new Face Beautification and Blink Detect technologies Tessera licenses OptiML Micro Via Pad technology to Qtech Tessrea licenses OptiML Micro Via Pad technology to AWLP and Qtech Tessera’s Face Tracking technology ships in Fujitsu chips Tessera introduces new Product Launch Services; offers OptiML single-element VGA lens Casio licenses Tessera’s Face Tracking technology R&D Magazine recognizes OptiML wafer-level camera technology in 2008 R&D 100 Awards Advanced Packaging Magazine honors Tessera’s wafer-level camera and wafer-level packaging technologies Samsung licenses OptiML Focus technology Tessera introduces OptiML Micro Via Pad wafer-level packaging technology for image sensors Tessera introduces OptiML Low Light, OptiML Zoom, OptiML Focus image enhancement solutions EDN Magazine honors OptiML wafer-level camera technology Tessera acquires FotoNation NemoTek licenses Tessera’s wafer-level camera and wafer-level packaging technologies Licensees ship more than 20 billion units using Tessera Compliant Chip® (TCC) CSP technology 2007 Toshiba licenses OptiML Focus technology Tessera opens R&D center in Japan Tessera introduces µPILR interconnect platform and OptiML WLC technology Tessera acquires Eyesquad Advanced Packaging Magazine recognizes SHELLCASE RT technology Electronic Products Magazine recognizes OptiML WLC 2006 Tessera acquires Digital Optics Corporation Tessera introduces SHELLCASE CF and SHELLCASE RT technologies Licensees ship more than 10 billion units using Tessera TCC technology Electronic Business Magazine ranks Tessera as 4th Fastest Growing Company Micron and Infineon license TCC chip scale packaging (CSP) technology  2005 Tessera acquires Shellcase, Ltd. Ernst & Young names Bruce McWilliams Entrepreneur of the Year for No. Calif. BusinessWeek Magazine ranks Tessera as 2nd Hottest Growing Company 2004 NxGen licenses Tessera µZ® ball stack package Matsushita, NEC and Oki license Tessera CSP technology 2003 Tessera completes successful initial public offering on Nasdaq R&D Magazine names µZ one of 100 most significant products of the year Electronic Product & Packaging Magazine recognizes µZ technology Advanced Packaging Magazine recognizes µZ technology 2002 Rohm licenses Tessera CSP technology Tessera introduces µZ multi-chip family of packaging solutions Tessera places 2nd in MIT Technology Review Magazine’s Patent Scorecard Tessera ranks 3rd in III’s Annual Tech. Report: Advanced Semiconductor Packaging Patents 2001 Tessera and Intel work together to develop stacked chip-scale packages Licensees ship more than 1 billion units using Tessera TCC technology Sharp licenses TCC CSP technology  2000 Meicer licenses µBGA® technology Tessera and Toshiba sign µBGA technology agreement 1999 ChipMOS, EEMS and Toshiba license µBGA technology Tessera and LG Electronics sign µBGA technology agreement 1998 Sharp becomes 20th licensee of Tessera packaging technology Rambus chooses µBGA technology as reference package for RDRAM 1997 Samsung selects Tessera µBGA package for high volume SRAM production Red Herring Magazine recognizes Tessera as one of top technology companies 1996 Intel adopts µBGA for flash memory devices 1995 Electronic Product & Packaging Magazine recognizes µBGA technology 1994 Hitachi licenses Tessera packaging technology Shinko Electric Industries Ltd. licenses Tessera technology 1993 R&D Magazine recognizes Tessera's multi-chip module system 1990 Tessera Compliant Chip (TCC) chip-scale packaging (CSP) technology patented Tessera founded by former IBM research scientists