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Milestones |
2010
- Tessera licenses FotoNation FaceTracker solution to SK Telesys
- Tessera licenses SHELLCASE MVP technology to JCAP
- Tessera ships one millionth OptiML lens
2009
- New Tessera FotoNation® technology enables face recognition for mobile devices
- Tessera developing 3 MP wafer-level optics (WLO) technology with EDOF
- Tessera and Motorola enter into technology license agreement
- Tessera acquires certain assets from Dblur
- Tessera® OptiML™ image enhancement solutions for up to 14 MP
- Tessera offers DigitalOptics™ lens array technology for parallel optics
- Tessera licenses wafer-level optics (WLO) to Qtech
- Tessera licenses µPILR™ technology to Kinsus
2008
- Tessera's OptiML™ wafer-level camera (WLC) technology recognized for photonics innovation
- Tessera SHELLCASE® technology shipped in one billion image sensors
- Tessera introduces new FotoNation® Beautification and FotoNation BlinkCheck Solutions
- Tessera licenses SHELLCASE® MVP Technology to Qtech
- Tessrea licenses SHELLCASE® technology to AWLP and Qtech
- FotoNation FaceTracker ships in Fujitsu chips
- Tessera introduces new Product Launch Services; offers OptiML single-element VGA lens
- Casio licenses FotoNation FaceTracker solution
- R&D Magazine recognizes OptiML WLC in 2008 R&D 100 Awards
- Advanced Packaging Magazine honors OptiML WLC and SHELLCASE® MVP
- Samsung licenses OptiML Focus technology
- Tessera introduces SHELLCASE MVP wafer-level packaging technology for image sensors
- Tessera introduces OptiML UFL, OptiML Zoom, OptiML Focus image enhancement solutions
- EDN Magazine honors OptiML WLC technology
- Tessera acquires FotoNation
- NemoTek licenses OptiML WLC and SHELLCASE technologies
- Licensees ship more than 20 billion units using Tessera TCC CSP technology
2007
- Toshiba licenses OptiML Focus technology
- Tessera opens R&D center in Japan
- Tessera introduces µPILR interconnect platform and OptiML WLC technology
- Tessera acquires Eyesquad
- Advanced Packaging Magazine recognizes SHELLCASE RT technology
- Electronic Products Magazine recognizes OptiML WLC
2006
- Tessera acquires Digital Optics Corporation
- Tessera introduces SHELLCASE CF and SHELLCASE RT technologies
- Licensees ship more than 10 billion units using Tessera TCC technology
- Electronic Business Magazine ranks Tessera as 4th Fastest Growing Company
- Micron and Infineon license TCC chip scale packaging (CSP) technology
2005
- Tessera acquires Shellcase, Ltd.
- Ernst & Young names Bruce McWilliams Entrepreneur of the Year for No. Calif.
- BusinessWeek Magazine ranks Tessera as 2nd Hottest Growing Company
2004
- NxGen licenses Tessera µZ® ball stack package
- Matsushita, NEC and Oki license Tessera CSP technology
2003
- Tessera completes successful initial public offering on Nasdaq
- R&D Magazine names µZ one of 100 most significant products of the year
- Electronic Product & Packaging Magazine recognizes µZ technology
- Advanced Packaging Magazine recognizes µZ technology
2002
- Rohm licenses Tessera CSP technology
- Tessera introduces µZ multi-chip family of packaging solutions
- Tessera places 2nd in MIT Technology Review Magazine’s Patent Scorecard
- Tessera ranks 3rd in III’s Annual Tech. Report: Advanced Semiconductor Packaging Patents
2001
- Tessera and Intel work together to develop stacked chip-scale packages
- Licensees ship more than 1 billion units using Tessera TCC technology
- Sharp licenses TCC CSP technology
2000
- Meicer licenses µBGA® technology
- Tessera and Toshiba sign µBGA technology agreement
1999
- ChipMOS, EEMS and Toshiba license µBGA technology
- Tessera and LG Electronics sign µBGA technology agreement
1998
- Sharp becomes 20th licensee of Tessera packaging technology
- Rambus chooses µBGA technology as reference package for RDRAM
1997
- Samsung selects Tessera µBGA package for high volume SRAM production
- Red Herring Magazine recognizes Tessera as one of top technology companies
1996
- Intel adopts µBGA for flash memory devices
1995
- Electronic Product & Packaging Magazine recognizes µBGA technology
1994
- Hitachi licenses Tessera packaging technology
- Shinko Electric Industries Ltd. licenses Tessera technology
1993
- R&D Magazine recognizes Tessera's multi-chip module system
1990
- Tessera Compliant Chip (TCC) chip-scale packaging (CSP) technology patented
- Tessera founded by former IBM research scientists
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