Craig Mitchell is senior vice president of the Interconnect, Components and Materials (ICM) division at Tessera. In this role, Mitchell defines the company’s business and technology strategy relating to the semiconductor packaging and electronics interconnect markets. He joined Tessera in 1992 to play a central role in developing and facilitating global adoption of Tessera’s advanced packaging technologies.

Prior to his current position, Mitchell was vice president of business development and sales, as well as vice president of marketing. His previous management positions include vice president of Tessera’s memory business, director of product and technical marketing, and director of field applications for the company.

Mitchell is named as inventor on 50 patents. In 2009, he completed Harvard Business School's Advanced Management Program. He holds a bachelor’s degree in electrical engineering from Manhattan College, New York City.