SAN JOSE, Calif.--(BUSINESS WIRE)--Mar. 10, 2009--
Tessera Technologies, Inc. (Nasdaq:TSRA) will be featured in three
sessions on wafer-level packaging technology at the IMAPS Device
Packaging conference. Moshe Kriman, vice president, engineering,
Micro-electronics, will give two presentations on wafer-level package
solutions for image sensors using Through Silicon Via (TSV) technology.
Piyush Savalia, mechanical engineer, Micro-electronics, will give a
presentation on design aspects of chip-scale package solutions using a
wafer-stack process.
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WHEN:
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Delivering Cost Effective Wafer-Level and 3D Packages with TSV
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March 10, at 11:30 a.m.
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Delivering High Reliability from a Wafer-Scale, Chip-Sized Package
Incorporating a TSV Solution
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March 11, at 2:30 p.m.
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Structural Design Aspects for Reliability of High-Density Chip-Scale
Packages Using a Wafer-Stack Process
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March 12, at 8:30 a.m.
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WHERE:
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IMAPS Device Packaging 2009
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Fort McDowell Resort and Casino
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Scottsdale, AZ
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About Tessera
Tessera Technologies, Inc. delivers miniaturization technologies that
transform electronic products. The company’s packaging and interconnect
solutions enable smaller, higher-functionality electronic devices.
Tessera’s imaging and optics solutions provide low-cost, high-quality
camera functionality in electronic products and include image sensor
packaging, wafer-level optics and image enhancement intellectual
property. The company also offers customized micro-optic lenses, from
diffractive and refractive optical elements to integrated micro-optical
subassemblies. Tessera licenses its technologies, as well as delivers
products based on these technologies, to promote the development of the
supply chain infrastructure. The company is headquartered in San Jose,
California. For information call 1.408.321.6000 or go to www.tessera.com.
Tessera and the Tessera logo are trademarks or registered trademarks of
Tessera Inc. or its affiliated companies in the United States and other
countries. All other company, brand and product names may be trademarks
or registered trademarks of their respective companies.
Source: Tessera Technologies, Inc.
Tessera
Judy Erkanat, +1-408-321-6751
jerkanat@tessera.com
or
LEWIS
PR for Tessera
Catherine Koo or Nicole Wasowski, +1-415-992-4400
Tessera@lewispr.com
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