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Tessera to Present on Wafer-Level Packaging at IMAPS 2009

SAN JOSE, Calif.--(BUSINESS WIRE)--Mar. 10, 2009-- Tessera Technologies, Inc. (Nasdaq:TSRA) will be featured in three sessions on wafer-level packaging technology at the IMAPS Device Packaging conference. Moshe Kriman, vice president, engineering, Micro-electronics, will give two presentations on wafer-level package solutions for image sensors using Through Silicon Via (TSV) technology. Piyush Savalia, mechanical engineer, Micro-electronics, will give a presentation on design aspects of chip-scale package solutions using a wafer-stack process.

WHEN:

      Delivering Cost Effective Wafer-Level and 3D Packages with TSV

March 10, at 11:30 a.m.

 
Delivering High Reliability from a Wafer-Scale, Chip-Sized Package Incorporating a TSV Solution
March 11, at 2:30 p.m.
 
Structural Design Aspects for Reliability of High-Density Chip-Scale Packages Using a Wafer-Stack Process
March 12, at 8:30 a.m.
 

WHERE:

IMAPS Device Packaging 2009
Fort McDowell Resort and Casino
Scottsdale, AZ

About Tessera

Tessera Technologies, Inc. delivers miniaturization technologies that transform electronic products. The company’s packaging and interconnect solutions enable smaller, higher-functionality electronic devices. Tessera’s imaging and optics solutions provide low-cost, high-quality camera functionality in electronic products and include image sensor packaging, wafer-level optics and image enhancement intellectual property. The company also offers customized micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. Tessera licenses its technologies, as well as delivers products based on these technologies, to promote the development of the supply chain infrastructure. The company is headquartered in San Jose, California. For information call 1.408.321.6000 or go to www.tessera.com.

Tessera and the Tessera logo are trademarks or registered trademarks of Tessera Inc. or its affiliated companies in the United States and other countries. All other company, brand and product names may be trademarks or registered trademarks of their respective companies.

Source: Tessera Technologies, Inc.

Tessera
Judy Erkanat, +1-408-321-6751
jerkanat@tessera.com
or
LEWIS PR for Tessera
Catherine Koo or Nicole Wasowski, +1-415-992-4400
Tessera@lewispr.com

 
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