DSP/ASIC

DSPs and ASICs are specialized microprocessors used in numerous applications, including wireless handsets. Tessera's µBGA® packaging solutions provide the small size, high performance and high reliability characteristics required for DSPs and ASICs. With the availability of two-metal layer substrates, µBGA® packages can expand to accommodate the high I/O counts that are common to many ASICs. Tessera's stacked µBGA® technology also enables assemblers to match ASICs with memory devices, such as DRAM and Flash, providing an extremely compact solution.