Worldwide Headquarters    
Tessera Technologies, Inc.
3099 Orchard Dr.
San Jose, CA 95134
(408) 894-0700 - Telephone
(408) 894-0768 - Fax
www.tessera.com
Nasdaq: TSRA

Corporate Overview
Tessera is a leading provider of miniaturization technologies for the electronics industry.  Tessera enables new levels of miniaturization and performance by applying its unique expertise in the electrical, thermal and mechanical properties of materials and interconnect.  Tessera's technologies are widely adopted in high-growth markets, including consumer, computing, communications, medical and defense electronics.  More than 15 billion semiconductors worldwide incorporate Tessera's technology.

Technology
Since 1990, Tessera has been developing technologies that have anticipated and successfully addressed market demands for smaller, higher-performing electronic products at lower cost.  By meeting these requirements, the company's technology has enabled the development of a broad range of electronics used by millions of people every day. Cellular phones, PDAs, PCs, laptops, gaming consoles, MP3 players, hearing implants and defense electronics are just a few of the products that incorporate Tessera's patented technology.

Tessera's product offering includes a wide range of semiconductor packaging and interconnect technologies. A semiconductor package is the physical and electrical interface between a semiconductor chip and the system in which it operates. In the early 1990s, Tessera introduced a visionary chip-scale package, known as the μBGA® package. This packaging solution is nearly the same size of the chip itself. Tessera's highly innovative μBGA® package led to the wide-scale adoption of chip-scale packages, which are pervasively used in electronic products today.

Today, Tessera continues to push the boundaries of electronics miniaturization and performance. Tessera's μZ® multi-chip product line builds on the company's foundational μBGA® chip-scale technology and makes it possible to stack multiple chips within the footprint of a single package. Tessera also provides world-leading wafer-level packaging technologies, which are packages manufactured at the wafer level and are essentially identical in size to the chip itself. Today, the world's largest cellular phone manufacturers utilize Tessera's multi-chip and wafer-level packages for memory chips and image sensors in cellular phones and other products.  

Tessera continues to envision the future of electronics and is leveraging its extensive expertise and technology portfolio to solve the challenge of miniaturization and performance from the component, module and system level.

Services
Tessera offers a full suite of engineering, assembly and infrastructure services. Custom package design, simulation and prototype manufacturing services are available to companies in the initial stages of product development. Tessera also provides training, consulting, qualification, testing and licensing services for rapid and cost-effective installation and upgrade of advanced packaging assembly lines using Tessera's technology.

Licensees
Tessera's licensees include the many of the world's prominent semiconductor manufacturers and assembly service providers, such as Hynix, Infineon, Intel, Matsushita (Panasonic), Micron, NEC, NXP, Powertech Technology, Qimonda, Renesas, Samsung, Sharp, Sony, Texas Instruments and Toshiba. Most of the top 20 semiconductor companies in the world are Tessera customers.