| 2007 |
- Tessera recognized in Deloitte Technology Fast50 Program
- Alps Electric Co. Ltd. licenses Tessera OptiML® wafer-level camera (WLC) technology
- Tessera introduces industry’s first WLC technology for mobile phones
- Tessera introduces MicroPILR™ next-generation interconnect platform
- Tessera acquires Eyesquad
- Advanced Packaging Magazine recognizes Tessera SHELLCASE®-RT technology for excellence in semiconductor packaging
- Tessera wins ACG Emerging Growth Award
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| 2006 |
- Tessera acquires Digital Optics Corporation
- Tessera introduces SHELLCASE-CF and SHELLCASE-RT wafer-level packaging technologies
- Tessera recognized in Deloitte Technology Fast50 Program and Fast500 Program
- Tessera licensees ship more than 10 billion semiconductors using Tessera packaging technology
- Electronic Business Magazine ranks Tessera as 4th Fastest Growing Company in America
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| 2005 |
- Tessera acquires SHELLCASE, Ltd.
- Ernst & Young names Bruce McWilliams Entrepreneur of the Year for Northern California
- Tessera recognized in Deloitte Technology Fast50 Program
- Business Week Magazine ranks Tessera as 2nd Hottest Growing Company in America
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| 2004 |
- NxGen licenses Tessera µZ® Ball Stack Package
- Tessera recognized in Deloitte Technology Fast500 Program
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| 2003 |
- Tessera complete successful initial public offering on Nasdaq
- R&D Magazine names Tessera µZ Fold-Over Package one of the 100 most technologically significant products of the year
- Electronic Product & Packaging Magazine recognizes Tessera µZ Fold-Over Package for excellence in semiconductor packaging
- Advanced Packaging Magazine recognizes Tessera µZ Fold-Over Package for excellence in semiconductor packaging
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| 2002 |
- Tessera introduces µZ multi-chip family of packaging solutions
- Tessera places 2nd in MIT Technology Review Magazine’s Patent Scorecard
- Tessera ranks 3rd in International Interconnection Intelligence’s Annual Technology Report – Advanced Semiconductor Packaging Patents
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| 2001 |
- Tessera licensees ship more than 1 billion semiconductors using Tessera packaging technology
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| 1999 |
- Bruce McWilliams appointed president and CEO
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| 1998 |
- Sharp Corporation becomes 20th licensee of Tessera packaging technology
- Rambus chooses Tessera µBGA® package as its reference package for RDRAM used in PCs, 3D gaming consoles and networking devices
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| 1997 |
- Samsung selects Tessera µBGA package for high-volume production of SRAMs for wireless handsets and other mobile devices
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| 1996 |
- Intel adopts Tessera µBGA package for Flash memory devices used in wireless handsets and other mobile products
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| 1995 |
- Electronic Product & Packaging Magazine recognizes Tessera µBGA technology with the Milton S. Kiver Grand Award
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| 1994 |
- Tessera adopts intellectual property (IP) business model
- Shinko Electric Industries Ltd. licenses Tessera technology
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