Tessera's patent portfolio includes US and foreign patents and patent applications related to Chip Scale Packaging, as well as numerous other areas related to semiconductor packaging. These include chip-scale, chip-size and wafer-level packages, sockets, probe cards, substrates, interposers, manufacturing equipment and methods for making such devices.
Detailed descriptions of US patents can be found at the following Web sites by doing a keyword search on Tessera.
The US Patent and Trademark Office
http://www.uspto.gov
The IBM Intellectual Property Network
http://www.delphion.com
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