DigitalOptics^TM solutions from Tessera include Integrated Micro-Optical Subassemblies (IMOS), which enable the integration of wafer-level optics with different passive and active devices to produce highly-miniaturized optical and electro-optic modules.

DigitalOptics IMOS demonstrate functionality and versatility, providing compact, cost-effective, high-performance solutions. They integrate passive optical elements such as optics, filters and gratings, with active components such as lasers, detectors and sensor dies. This integration takes place at the wafer or die level, enabling significant benefits over conventional technologies.

DigitalOptics IMOS provide solutions for applications including wafer-level cameras, memory storage, optical communications, machine control and micro-projection.

For more information on Micro-Optics solutions, please click the button and complete the attached form.