| Defense & Intelligence |
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| Electronics Miniaturization Technologies and Services |
Expertise
- Applications engineering
- System configuration
- Component selection
- Thermal analysis and design
- Power Distribution
- Signal integrity analysis
- Mechanical analysis and design
- Materials selection
- Package design
- Prototype build
- Thermal/mechanical verification
- Functional test
- Concurrent design
Programs
- Wearable electronics
- Sensor Networks
- Systolic aray
- Anti-sniper system
- Small satellites
- Reconfigurable multiprocessors
- Controlled environment servers
- Smart munitions
- Spintronics aplications
- Miniature voice recorder
Product Miniaturization Building Blocks
- Chip-scale packaging
- Advanced materials & interconnects
- Multi-chip packaging
- 3D integration
- System-in-Package (SiP)
- Integrated passives
- Advanced thermal management
- EMI shielding
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Corporate Profile
- NASDAQ:TSRA
- 2004 Revenue: $72 million
- Founded in 1990, IPO in 2003
- ISO 9002 facility in San Jose, CA
- Class 1,000 / 10,000 cleanrooms for development, low volume, and small run production
- DCAA audited accounting system
History of Innovation
- World leader in electronics miniaturization
- Introduced µBGA® technology in 1990
- Over 388 patents issued
- 55+ licensees of Tessera technology
- Over 5 billion semiconductors with Tessera technology
- Numerous awards for innovation from industry publications
Customers and Partners
- Government
- Industry
- University
- Licensees
- Tessera HQ
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