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Tessera’s OptiML™ family of imaging and optics solutions enables you to deliver the most advanced camera capabilities for the world’s smallest camera devices.
By 2014, wafer-level optic shipments will reach more than 1 billion units in sales1. Tessera's wafer-level camera solutions address that market, enabling the cost-effective integration of miniature cameras in cell phones, personal computers and other portable devices.
- OptiML Image Enhancement Technology
Tessera’s innovative image enhancement solutions transform camera-enabled devices, offering a range of capabilities from high-quality auto-focus and zoom to face detection and red-eye correction. From software to silicon to optics, Tessera offers a full range of solutions to fit your camera module needs.
- OptiML Wafer-Level Optics
Tessera’s advanced wafer-level optics technology enables miniature camera modules to be built more reliably and cost-effectively, using reflow compatible materials and an innovative wafer stacking and packaging process. Whether you are developing an entire camera module or need a lens for an existing module, Tessera’s solutions provide high-performance camera capabilities in a small, slim form factor.
- OptiML Wafer-Level Packaging
To meet market demands for smaller cameras with more features, Tessera’s wafer-level packaging technology enables image sensors that are thinner, more reliable and less expensive. To date, more than 1 billion image sensors have been shipped using Tessera technology.
By 2013, more than 80% of cell phones will include one or more camera modules – a market size of over 1.7 billion units2. Tessera’s compact camera module solutions provide the key components necessary to bring digital still camera performance to mobile and portable camera platforms.
- OptiML Image Enhancement Technology
From software to silicon to optics, Tessera’s innovative image enhancement solutions transform camera-enabled devices, offering a range of capabilities from high-quality auto-focus and zoom to face tracking and image stabilization.
- OptiML Wafer-Level Packaging
To meet market demands for smaller cameras with more features, Tessera’s wafer-level packaging technology enables image sensors that are thinner, more reliable and less expensive.
Tessera develops and delivers custom micro-optic elements and systems for high-precision, high-performance applications such a semiconductor manufacturing equipment, photonics solutions and communications devices.
Tessera offers both standard and custom system-level solutions for your camera module needs. For additional information, contact us.
1 Yole Developpement January 2010
2 TSR November 2009
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