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Henry Nothhaft
Michael Anthofer
Robert Yung
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Bernard Cassidy
John Keating
H. Thomas Blanco
Craig Mitchell
Brian Marcucci
Liam Goudge
Executive Team
Robert Boehlke
Nicholas Brathwaite
John Goodrich
Bruce McWilliams
David Nagel
Henry Nothhaft
Robert Young
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Flyer: OptiML™ MEMS Auto-Focus
Flyer: OptiML MEMS Shutter
White Paper: MEMS Digital Camera
Software
Flyer: OptiML Face Tools
Flyer: OptiML Focus
Flyer: OptiML Low-Light
Flyer: OptiML Red-Eye
Flyer: OptiML Video Tools
Flyer: OptiML Zoom
Optics
Flyer: OptiML Focus
Flyer: OptiML Low-Light
Flyer: OptiML Zoom
Appnote: Face Beautification
Appnote: Face Beautification Japanese
Appnote: Face Tracking
Appnote: Face Tracking Japanese
OptiML Wafer-Level Optics
Flyer: Wafer-Level Optics
White Paper: AOE Wafer-Level Camera
White Paper: Low Cost Camera Module
OptiML Wafer-Level Packaging
Flyer: OptiML Micro Via Pad
White Paper: Cost Reduction and Reliability Enhancement of Solid State Image Sensors by Wafer Level Chip Size Packaging Technology using New Materials
White Paper: Novel and Low Cost Through Silicon Via Solution for Wafer Scale Packaging of Image Sensors
White Paper:Low-Cost, Compliant Wafer-level Packaging Technology
White Paper: Low Cost Through Silicon Via Solution Compatible with Existing Assembly Infrastructure and Suitable for Single Die and Die Stacked Packages
White Paper: Optical Performance of Bare Image Sensor Die and Sensors Packaged at the Wafer Level and Protected by a Cover Glass
White Paper: High-Density, Wafer-Level Package Interconnect Providing a Reliable and Low-Cost Alternative to Through Silicon Vias for Image Sensors
OptiML Micro-optics
Flyer: Communications
Flyer: Photonics
Flyer: Semiconductor
Case Study: Enabling Clarity in Virtual Keyboards
Case Study: Enabling High-Speed Data Transmission
Videos
Face Tracker Video
Video Tools Video
Wafer-Level Camera Process Video
Zoom Video
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