Tessera Wafer-Level Camera technologies, including wafer-level optics and image sensor packaging, enable manufacturers to significantly advance the integration of miniaturized cameras in cell phones, personal computers, security cameras and other portable devices.

Using breakthrough OptiML™ Wafer-Level Optics and SHELLCASE^® MVP solutions, camera modules can be built more efficiently using reflow compatible materials, and an innovative wafer stacking and packaging process. This wafer-level approach enables manufacturers to achieve economy of scale while producing camera modules that are thin, reliable and cost effective.

Tessera’s approach allows manufacturers to simultaneously build thousands of lenses on a single wafer. Based on advanced semiconductor manufacturing techniques, Tessera’s OptiML wafer-level optics technology makes it possible to manufacture camera modules at the wafer level, dramatically reducing the size and total materials cost of camera modules while maintaining camera performance. Using reflow-compatible materials to build the optical elements of the camera module enables it to be efficiently mounted directly onto a phone board, leveraging the same solder reflow process used for assembling other electronics on the same board.