Tessera | Facilities and Capabilities

Tessera’s ongoing investment in innovation fuels a growing portfolio of worldwide patents (over 1900 as of 1Q 2010) in the areas of imaging and optics, semiconductor packaging and interconnect and thermal management. As a leader in micro-electronics, the company operates packaging and interconnect laboratories and prototype assembly facilities at its headquarters in San Jose, California and research center in Yokohama, Japan. The company’s office located in Charlotte, North Carolina is home to its Wafer-Level and 3D Process Development Center, featuring Tessera’s ground-breaking wafer-level technologies for image sensors.

Tessera's Worldwide Locations for Semiconductor and Micro-electronics, packaging, interconnect and integrated solutions

With fully equipped clean room facilities and more than 250 dedicated technologists, Tessera’s expertise and capabilities include:

Packaging, Interconnect and Integration Solutions
San Jose, California and Yokohama, Japan

Design and Simulation
Materials Research and Characterization
Advanced Substrate Prototyping
Prototype Assembly
Reliability and Failure Analysis

Wafer-level Packaging
Charlotte, North Carolina

Wafer-Level Processing
Wafer-Level Stacking for Flash Memory
Wafer-Level Optics

Tessera is leading the way in the development and delivery of miniaturization solutions that are transforming electronic products. If you are challenged by product size and functionality requirements and in need of advanced packaging and interconnect solutions, we invite you to contact us to find out how we can help your company be more competitive today.