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| Facilities and Capabilities |
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| Packaging, Interconnect and Integration Solutions |
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Tessera invests in, develops and licenses next-generation technologies for the wireless, computing and consumer markets. Since its inception in 1990, Tessera’s commitment to leading-edge technology has remained clear:
Innovation
Developing and delivering solutions enabling higher performance and faster time-to-market for our customers’ products
Investment
Lowering our customers’ R&D costs and facilitating access to our industry-leading inventions and innovation
Infrastructure
Enabling broad adoption and integration of our technologies across the semiconductor supply chain | |
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Tessera’s ongoing investment in innovation fuels a growing portfolio of worldwide patents (over 1800 as of 12/31/2009) in the areas of imaging and optics, semiconductor packaging and interconnect and thermal management. As a leader in micro-electronics, the company operates packaging and interconnect laboratories and prototype assembly facilities at its headquarters in San Jose, California and research center in Yokohama, Japan. The company’s office located in Charlotte, North Carolina is home to its Wafer-Level and 3D Process Development Center, featuring Tessera’s ground-breaking SHELLCASE® wafer-level technologies for image sensors. |
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Tessera's Worldwide Locations |
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With fully equipped clean room facilities and more than 250 dedicated technologists, Tessera’s expertise and capabilities include:
Packaging, Interconnect and Integration Solutions
San Jose, California and Yokohama, Japan
- Design and Simulation
- Materials Research and Characterization
- Advanced Substrate Prototyping
- Prototype Assembly
- Reliability and Failure Analysis
Wafer-level Packaging
Charlotte, North Carolina
- Wafer-Level Processing
- Wafer-Level Stacking for Flash Memory
- Wafer-Level Optics
Tessera is leading the way in the development and delivery of miniaturization solutions that are transforming electronic products. If you are challenged by product size and functionality requirements and in need of advanced packaging and interconnect solutions, we invite you to contact us to find out how we can help your company be more competitive today.
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| View our Capabilities and Expertise Chart. | |
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Tessera’s ongoing investment in innovation fuels a growing portfolio of worldwide patents (1718 as of 2Q 2009) in the areas of imaging and optics, semiconductor packaging and interconnect and thermal management. As a leader in micro-electronics, the company operates packaging and interconnect laboratories and prototype assembly facilities at its headquarters in San Jose, California and research center in Yokohama, Japan. The company’s office located in Charlotte, North Carolina is home to its Wafer-Level and 3D Process Development Center, featuring Tessera’s ground-breaking SHELLCASE® wafer-level technologies for image sensors. |
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Tessera's Worldwide Locations |
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|
With fully equipped clean room facilities and more than 250 dedicated technologists, Tessera’s expertise and capabilities include:
Packaging, Interconnect and Integration Solutions
San Jose, California and Yokohama, Japan
- Design and Simulation
- Materials Research and Characterization
- Advanced Substrate Prototyping
- Prototype Assembly
- Reliability and Failure Analysis
Wafer-level Packaging
Charlotte, North Carolina
- Wafer-Level Processing
- Wafer-Level Stacking for Flash Memory
- Wafer-Level Optics
Tessera is leading the way in the development and delivery of miniaturization solutions that are transforming electronic products. If you are challenged by product size and functionality requirements and in need of advanced packaging and interconnect solutions, we invite you to contact us to find out how we can help your company be more competitive today.
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| View our Capabilities and Expertise Chart. | |
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