Tessera | Micro-Electronics, Semiconductor Packaging, Substrate Interconnect & Thermal Management

Tessera invests in, licenses, and delivers technologies that enable new levels of miniaturization and product performance in electronics.

Tessera's Micro-Electronics business focuses extensive worldwide research, development and manufacturing resources on technology areas that are critical to today's leading-edge products and enable engineers to plan and develop next generation devices. The Micro-Electronics mission is to deliver innovative solutions in the areas of: Semiconductor Packaging, Substrate Interconnect and Thermal Management.

Semiconductor Packaging is the physical protection for a semiconductor chip including the electrical connections from the chip to the system in which it operates. Historically, package size has been a key limitation to overall product size reduction and performance. The company’s innovations include Tessera Compliant Chip^® (TCC) technology and the visionary µBGA^® ball grid array that have provided the semiconductor industry with reliable chip scale package (CSP) solutions and pioneered new levels of integration and miniaturization in portable electronics. The µBGA family features short electrical paths between the die and the module or printed circuit board (PCB) and has been widely adopted for high-performance DRAM packaging. Tessera’s portfolio of packaging technologies includes many innovative solutions and implementations, which can be optimized to fit a variety of design and product needs.

Substrate Interconnect is the network of electrical pathways between electrical components. These comprise of: metal traces on or within layers in a package substrate, flexible printed circuit (FPC) or PCB; the vertical via connections between layers; and the means for connecting substrates to semiconductor chips or to each other. Tessera's µPILR™ technology provides solutions designed to overcome the technical limitations of conventional interconnect such as pitch, profile, performance, reliability and test capacity. Tessera’s extensive research and development efforts are focused to apply µPILR technology to achieve dense interconnection of components for CSP Package-on-Package stacking and advanced flip chip package substrate technologies.

Thermal Management conducts heat away from the functioning electronics and dissipates it to the environment to allow the components to operate at optimum efficiency. The densification of electronics for today’s leading-edge portable products presents many new thermal challenges including cooling hardware size, noise and power consumption. Tessera is leveraging its expertise in miniaturization to develop break-through thermal management technology to address the need for quiet, more efficient and smaller form factor solutions to remove heat from portable electronics.

Bringing new technologies to the market requires coordination with vendors across the entire supply chain to ensure manufacturers have the materials and capabilities they need to respond to customer demand. Tessera continues to invest in its relationships with leading substrate vendors, materials and equipment suppliers as well as subcontract assemblers to make sure the right mix of supporting materials and services are available.

Tessera Technologies, Micro-Electronics, Semiconductor Packaging, Substrate Interconnect and Thermal Management