Heat is the primary cause of electronics failure. At the core of each electronic device is a processor that executes instructions and consumes power. Higher execution speed demanded by increased functionality of the processor generates higher heat that must be dissipated. This heat may be spread within the product case but eventually is transferred to the ambient air. Mechanical fans have traditionally been used to drive air over hot surfaces, increasing the amount of heat transferred. However, fans are noisy and have become a limiting factor in making products thinner.

A pioneer in chip scale packaging, Tessera is applying its industry-leading miniaturization expertise to thermal management solutions for more efficient heat dissipation than provided by traditional fans or other air cooling methods.

Silent Air Cooling Technology

Tessera is developing a unique silent air cooling technology. The technology works by generating a high intensity electric field that ionizes air molecules surrounding a corona electrode. As ions move from the corona electrode to the collector electrode, they collide with neutral air molecules, transferring charge and momentum. When the ions reach the collector electrode they are de-ionized, but a net airflow has been produced. This airflow can be used in cooling electronics. Tessera’s innovative thermal management technology for notebooks facilitates:

Features and Benefits of Silent Air Cooling Technology: