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| Multi-Chip Packaging |
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| µZ® Multi-Chip Package Solution |
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| Tessera’s chip scale packaging (CSP) technology supports a variety of multi-chip packaging implementations. The µZ® multi-chip package (MCP) solution provides a flexible platform to satisfy the diverse requirements for stacked, Package-on-Package (PoP) and System-in-Package (SiP) designs. These packages can be used in a wide variety of end-user products such as game consoles, set-top boxes, HDTV, wireless and hand-held devices, and computing and networking systems. |
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| Tessera’s multi-chip solution deploys the features of µBGA® ball grid array technology in three dimensions to optimize performance and reliability while meeting size constraints and lowering overall system cost. It includes technologies for mixed die packaging, die stacking and package stacking through substrate folding and by ball stacking. These technologies can be deployed individually or in combination to provide the most cost-effective, high-yield solution that meets multi-chip package requirements for smaller footprint, lower profile and better performance. |
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| μZ® Multi-Chip Package |
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| Features and Benefits of µZ multi-chip packaging include: |
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- Increased functionality or memory density within the same footprint
- Integration at the package level of single- or multiple-sourced die types
- Intermediate test and burn-in provides high final package yields
- 3D stacking through substrate folding and by ball stacking
- Uses conventional CSP/BGA assembly lines and production processes
- Tessera Compliant Chip® technology for high reliability
- Lead-free compatible
- Lower system board cost resulting from simplified board routing requirements
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| Through its worldwide research and development centers Tessera continues to lead in the development and deployment of multi-chip packaging technologies. | |
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