Tessera | Substrate Interconnect

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Tessera Technologies, Inc.,Technologies, packaging and interconnect solutions, semiconductor miniaturization, imaging and optics solutions

μPILR^™ Technology

A recognized leader in chip scale (CSP) packaging technology, Tessera is breaking new ground with its advanced µPILR^™ interconnect platform that allows the fabrication of high-density, high-performance connectivity solutions for die-to-package, package-to-printed circuit board (PCB), package-to-package and micro via connectivity for package substrates, PCB, and Flexible Printed Circuit (FPC). The company delivers ongoing innovation to the industry through research and development in substrate interconnect technology at its facilities in San Jose, California and Yokohama, Japan.


µPILR PoP Substrate		Flip Chip Substrate		PCB & FPC Substrate

µPILR technology is an advanced interconnect solution designed to overcome technical limitations such as pitch, profile, performance, reliability and test capacity associated with conventional packaging and substrate technologies. Tessera’s µPILR interconnect platform leverages existing substrate fabrication and assembly processes and infrastructure to enable rapid integration into a broad range of electronic devices.

Features and Benefits of µPILR Substrate Interconnect include:

Package Substrates (Package-on-Package)
Replaces BGA solderballs with fine pitch copper posts

Flip Chip Substrates
Copper posts on substrate for flip chip connections ≤150µm

PCB and Flexible Printed Circuit (FPC)
Fine pitch solid copper micro-vias, thermal vias, EM shielding and embedded technologies

Tessera's µPILR interconnect platform includes 3D packaging solutions allowing engineers to integrate greater functionality in the same footprint, reducing the size and cost while providing flexibility for the form factor of the final product.

µPILR technology is positioned to become a fundamental building block in next-generation wireless, computing and consumer electronic products by enabling greater levels of miniaturization, integration and functionality.

Licensing Program
Tessera is working closely with substrate providers and package assemblers to support the demand for its innovative interconnect solution and is licensing μPILR substrate and μPILR packaging technologies. Contact us to find out how Tessera’s µPILR technology is transforming the future and enabling the next generation of electronic products.

Additional material can be found on the Resources page.