µBGA® CSPs Overview
Tessera's µBGA® family of CSPs includes our lead-bonded µBGA® package and µBGA®-W, a wire-bonded package that provides greater design flexibility and fewer steps in the assembly process. Together, they meet the performance, size and reliability requirements of chip manufacturers that supply OEMs with:
- High performance DRAM (Dynamic Random Access Memory), including RDRAM (Rambus DRAM) and DDR SDRAM (Double Data Rate Synchronous DRAM)
- Flash memory
- SRAM (Static Random Access Memory)
- DSPs (Digital Signal Processors)
- ASICs (Application Specific Integrated Circuits)
The face-down structure of µBGA® CSPs, in which the front side of the silicon die faces the printed circuit board (PCB), ensures a short electrical path between the die and PCB or module. This design enables the package to deliver the type of performance for which high performance DRAM was created. As true CSPs, Tessera's µBGA® family of packages are only slightly larger than the die, offering significant savings in PCB real estate that enable smaller DSP, flash memory and other solutions required by wireless and portable device OEMs. Through volume expansion as well as improvements to manufacturing components, process and equipment, Tessera and its infrastructure suppliers have made µBGA® a cost-effective packaging solution.
If you are interested in our µBGA® technology, please contact us at info@tessera.com. |
