This chip scale semiconductor package technology approach relies on a compliant structure within the package structure. This solves the reliability issues associated with the thermal expansion mismatch between the silicon die and the printed circuit board (PCB), creating a small format, highly reliable fine pitch ball grid array. Tessera's compliant package technology eliminates costly underfill, allowing board rework to be easily performed.

The µBGA® package features short signal paths for reduced parasitics, providing good electrical performance. Enhanced thermal performance is achieved by heatsinking directly to the exposed back surface of the die.

The package can be surface mounted with conventional high-speed placement equipment currently used in the PCB assembly infrastructure.

Tessera's µBGA® package has been adopted across a broad range of applications due to its size, reliability and performance advantages. Over the past 10 years Tessera has established an infrastructure that offers materials, equipment and test solutions, enabling a smooth package development process from design to final implementation.

If you are interested in our µBGA® technology, please contact us at info@tessera.com.