Face -up µBGA®
Tessera's technology can be used to create reliable Face-Up µBGA® packages. The chip is oriented in this package such that its contacts face away from and are wire-bonded to the package substrate to electrically connect the chip to the package's solder connections.
 Tessera's Face-Up µBGA® technology is highly suitable for a wide range of semiconductor applications including Memory, and ASICs. These are usable in a range of products, including cell phones and PDAs, as well as personal computers and workstations that don't require the high performance benefits.
Certain versions of the Face-Up µBGA® technology can take advantage of the existing µBGA® materials and assembly infrastructure, making it a cost competitive choice.
If you are interested in our Face-Up µBGA® technology, please contact us at info@tessera.com. |
