µBGA® Manufacturing Process
The development of the µBGA package represented a significant change in the packaging of IC's, but the µBGA assembly process itself has undergone an evolutionary process over the course of years in order to provide a process that is both cost-effective and scalable. This lead to what is known as Tessera's "4.0 Process" of µBGA assembly.
The 4.0 process is comprised of seven steps:
- Tape Conversion
- Die Mount
- Lead Bonding
- Encapsulation
- Solderball
- Test and Mark
- Singulation
Each of these steps was optimized to allow for the use of lower cost materials in the package construction and to make the processing as straightforward as possible.
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