µBGA® -W Features and Benefits
- Utilizes wire-bonding process
- Short traces allow for low inductance and capacitance which enables a high performance chip scale package
- Utilizes existing equipment and material infrastructure
- Supports a range of ball pitches down to 0.8 mm
- Versatility allows various DRAM types to be assembled in one CSP technology
- Compatible with die shrink on center bond configurations
- Package allows for center row and peripheral bond pads, in addition to parallel and staggered bond pad arrangements
- Compliant layer enables high, on-board reliability by relieving solder ball stress
- No board-level underfill is required, providing the option for rework
- Suitable for applications requiring light weight, small footprint and thin profile
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