uPILR

DRAM Stacking

DRAM Applications and Products

  • Blade servers, workstations, mobile computing
  • Networking
  • High density memory modules
  • Graphics cards
  • Game consoles, set-top boxes
  • Internet appliances, wireless, handheld devices

High density DRAM module solutions have been driven by the server and workstation market. However the demand for high density main memory solutions is developing in mobile computing, game consoles and handheld devices. This trend for increased density comes at a time when the DRAM industry is pushing increased performance with faster data rates, lower power and improved thermal solutions with the transition to DDR2 and DDR3. The low profile and short interconnect makes µPILR technology the ideal package stacking solution for current and next generations of DRAMs.


Technology Overview


Additional Resources


Additional Resources
Additional Press Coverage