SHELLCASE ® CF Technology Overview
SHELLCASE® CF, Tessera's new wafer level wire bond technology platform for
electronics that integrate optical components, such as miniaturized cameras in
camera phones, digital still cameras, and video camcorders. Suitable for image
sensors, some types of MEMs, and other optical-based devices, Shellcase CF
protects these components from contamination from the initial stage of
processing and is compatible with standard wire-bond assembly processes. An
immediate application of the technology is for CMOS and CCD image sensors used
in camera phones. Shellcase CF provides up to a 40% improvement in yield over
existing Chip-on-Board (COB) alternatives used to assemble these devices today.
This yield improvement is realized through the protection of the sensor's
active area from contamination and the ability to perform wafer-level optical
testing prior to module assembly, both of which significantly improve camera
module yield and dramatically reduce its overall cost .The combination of high
yield and low cost results in an extremely attractive solution for the industry
as it strives to meet consumer demand in camera phones and other portable
electronics.
Process Highlights
- Short WIP, rapid fabrication steps
- Built using proven Shellcase technology
- Uses commercially available materials and equipment
- Improved dicing process enables the use of standard width scribe lines
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