This new solution is based on Tessera’s industry-proven SHELLCASE wafer-level chip scale packaging (WLCSP) technology, which provides the benefits of reduced costs and accelerated time-to-market, without the need for modification or redesign to the image sensor wafer.

The innovative SHELLCASE MVP solution utilizes an electrophoretically encapsulated, glass-silicon sandwich structure to enable image-sensing capabilities through the actual packaging structure. Electrophoretic encapsulation of chip and interconnects provides a break-through in true WLCSP solutions.

The SHELLCASE MVP solution is offered in both cavity and non-cavity formats and leaded or lead-free bump formats. And the flexible package design and structure enable the incorporation of filters, as well as use of different package materials or processes, providing additional advantages for manufacturers.

Features

• Ultra thin package height
  
• Lowest form factor (X,Y,Z)
  
• Narrow, standard scribe line
  
• No need for any image sensor design change
  
• Tight design rules, finer bond pad pitch
• Standard SMT assembly
• TSV solution
• Enables 3D stacking with DSP
• Compatible with reflowable wafer-level camera
• Available in both cavity and non-cavity formats and leaded or lead-free bump formats
  

• Camera phones
  
• Digital cameras
  
• Computing devices
  
• Bar code readers
  
• Fax machines
  
• Digital scanners
  
• Medical devices
  
• Machine vision
  
• CD/DVD portable units
  
• Fingerprint identification

Reliability

For more information about the company's portfolio of image enhancement technologies, please email info@tessera.com