SHELLCASE® OC has been in commercial production since 2004, and can be found in a wide variety of devices, including camera phones, digital cameras and medical devices.

• Economies of scale enabled by waferlevel packaging and testing
• Miniaturization: True die size (X/Y) and low Z-height
• High yields: Die protected from contamination from stage one of the process
• Versatility: Flexible package design and structure, ability to incorporate filters
• Standard SMT assembly
• Superior quality: Mature, proven technology

• Package height: ~800 +/-25μm (without BGA)
• Optical properties are characterized by a glass cover with a transmittance of 91.2% in the 350-900nm range
• Custom package size and pin count
• Extremely accurate die rotation control during assembly (max. <± 0.01 )
• Precise die tilt control of <0.5mil during assembly.
• Termination type: BGA or LGA

• Camera phones
• Digital cameras
• Fax machines and digital scanners
• Machine vision
• CD/DVD portable units

SHELLCASE OC offers superior reliability due to its optimized design, materials and
processes for all types of image sensors.

Process Highlights

• Very precise wafer-level bonding +/- 20μm
• Image area immediately encapsulated by cavity glass in class 10 environment
• Tight Z-focal tolerances from image area to bottom of cover glass
• Innovative lithography method provides small pitches between package leads: 350μm and up
• Available with either lead or lead-free
  bumps

SHELLCASE® OC