SHELLCASE® OP is offered in two configurations: "face up", where the assembled die faces up towards the target image; or "face down" where the assembled die observes the target image through a port in the printed circuit board. SHELLCASE® OP has been in commercial production since 2002, and can be found in a wide variety of devices, including camera phones, digital cameras and medical devices.

• Economies of scale enabled by waferlevel packaging and testing
• Miniaturization: True die size (X/Y) and low Z-height
• High yields: Die protected from contamination from stage one of the process
• Versatility: Flexible package design and structure, ability to incorporate filters
• Standard SMT assembly
• Superior quality: Mature, proven technology

• Package height: ~630 +/-25μm (without BGA)
• Optical properties are characterized by a glass cover with a transmittance of 91.2% in the 350-900nm range
• Custom package size and pin count
• Extremely accurate die rotation control during assembly (max. <± 0.01 )
• Precise die tilt control of <0.5mil during assembly.
• Termination type: BGA or LGA

• Camera phones
• Light sensing
• Bar code readers
• Fax machines and digital scanners
• Photodiodes
• Medical devices

Reliability

SHELLCASE® OP offers superior reliability due to its optimized design, materials and processes for all types of image sensors.

Process Highlights

• Image area immediately encapsulated by optical transparent glass in class 10 environment
• Tight Z-focal tolerances from image area to bottom of cover glass
• Innovative lithography method provides small pitches between package leads: 350μm and up
• Available with either lead or lead-freebumps