Ball Stack
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| 4 Die µZ®-Ball Stack |
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| 8 Die µZ®-Ball Stack |
The µZ®-Ball Stack package is a multi-chip solution that is capable of increasing memory capacity 8x for memory modules while achieving a 40% reduction in height and 25% smaller than today's TSOPs. A new addition to Tessera's µZ® product family, the µZ®-Ball Stack Package is optimized for memory and wireless applications. This technology provides near-100% yield by allowing each die to be individually tested prior to stacking, thus overcoming common yield problems associated with multi-chip solutions. It also utilizes the existing CSP assembly infrastructure, ensuring lowest cost. A key application is the stacking of DDR-SDRAM chips, which enables OEMs and memory module manufacturers to increase the density of their memory boards by up to eight times the current density available today.
 This product is suited for servers, personal computing, and network appliances where more and more memory is required to support high-bandwidth applications. The Ball Stack package also provides an extremely cost-effective solution for wireless applications, enabling the user to determine a cost-effective trade-off between size and performance of the end-product.
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