Ball Stacked Manufacturing Process
The package design and material sets to support the Ball Stack production are conventional and complimentary to the capability of current CSP assembly lines. The technology accommodates various package structures types like face-up or face-down die with lead or wire-bonded interconnections. Additionally, a variety of package substrate types such as polyimide or laminate-based materials (e.g., BT or High Tg FR-4) may be used.
 Conventional BGA/CSP Assembly Process Steps
- Tape to Frame
- Die Mount
- Bonding
- Encapsulation
- Solder Ball Attach
- Singulation
- Electrical Test
- Marking
- Final Inspection
Once the individual packages have been assembled, conventional SMT processes are utilized to align and reflow components into a final, assembled part.
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