Chip Stack
The µZ® Chip Stack package utilizes Tessera's µBGA® packaging technology to create reliable FBGA format packages, such as Tessera's µBGA®-F package, combined with chip stacking.
This option offers the advantages of chip stacking in conjunction with the benefits of µBGA® package technology to continue to meet the demands for small, high performance, high reliability chip scale packages.
Tessera provides the option of µZ® Chip Stacking of different size die. If you are interested in our µZ® Chip Stack technology, please contact us at info@tessera.com
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