Chip Stack Features and Benefits
- The µZ™ Chip Stack Package design flexibility increases functionality or memory density within the same footprint
- Integration at the package level of single- or multiple-sourced die types
- Multi-chip Chip Stacking assembly leverages conventional CSP/BGA assembly lines and production processes
- Compliant chip technology relieves solder ball stress resulting in high reliability
- Processes are transferable to licensed assemblers to enable multiple sourcing
- 100% lead-free compatible, enabling green product design and manufacture
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