Fold-Over
 The µZ® Fold-Over package technology was developed to house a logic or microprocessor component, like a DSP. The technology uses flexible polyimide film-based substrate material furnished with one or two copper layers for inter-package circuit routing. The design of the substrate includes an extension on one side to form the "flap" which creates a memory interface where one or more devices (Flash, SRAM, DRAM, multi-chip packages, etc.), in various package types, can be surface mounted on the top. The result is a practical, PCB space-saving System-in-Package solution that meets mobile phone package height requirements. This approach results in wireless products that are smaller and lighter with more functionality.
This package-stacking solution allows the logic die to be tested, marketed, and sourced separately from the memory, while still allowing a single footprint for all. The key feature and benefit highlights of the fold-over solution compared to other multi-chip packages (MCPs), are the flexibility and versatility provided by combining die with differing wafer-level yield rates, multiple sources and testing methodology while offering an extremely thin package. The solution allows for logic devices and memory components to be surface mount attached together by either the package or board assembler. The ability to shift control of final integration to either the system or sub-system assembler allows for cost reduction and logistics simplification. Another advantage is that the Contract Manufacturer (CM) can purchase commodity memory devices separately to meet multiple memory configuration demands from OEMs.
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