Fold-Over Features and Benefits
- Small footprint results in up to a 67% reduction in the Logic/Memory board area of portable and wireless products
- Package design features a memory interface which provides increased functionality within the same footprint
- Low profile allows for the mounting of memory device(s) while satisfying OEM product thickness requirements
- Suitable for component integration programs requiring light weight, low profile and small footprint
- Design flexibility to mount die face-up or face-down with wire or lead bond interconnect technology
- Coventional CSP/BGA assembly lines and production processes are utilized with the addition of the fold operation
- Test before stack option results in near 100% final package yield
- Solder ball stress is relieved by Tessera's patented chip package technology resulting in high on-board reliability
- No board-level underfill is required, providing the option for rework
- Lead-free compatibility enables green-product design and manufacture while maintaining high reliability
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