Fold-Over Manufacturing Process
The µZ Fold-Over utilizes coventional CSP/BGA assembly lines and production processes with the addition of the fold operation.
Conventional BGA/CSP Assembly Process Steps
- Tape to Frame
- Die Mount
- Bonding
- Overmold
- Solder Ball Attach
- Singulation
- Electrical Test
- Marking
- Final Inspection
Fold Operation
Once the individual packages have been assembled, the memory packages are surface mount attached on top by either the package or board assembler. |
