Folded Die Stack
Tessera's Folded Die Stack technologies utilize a folding technique to combine multiple die in a single CSP. Tessera has developed a 3 die stack that combines 3 die in 1.0 mm package and 4 die in 1.2 mm package. Tessera is currently in development of other folded die stacked solutions that will go beyond 4 die and combine memory with ASICs, such as baseband processors, and other high pin-count semiconductors. Tessera's folded die stacked technologies are suitable for mobile phones, MP3 players, and other portable devices that require small size and increased functionality.
3-Die µZ®-Folded Die Stack prior to folding and afterwards
If you are interested in our Folded Die Stacked technologies, please contact us at info@tessera.com. |
