Language: SEARCH µBGA® CSPs µPILR™ µZ® MCPs Wafer Level Camera Wafer Level Packaging Micro Optics Smart Optics Smart Imaging Overview Fold-Over Ball Stack Folded Die Stack Chip Stack Folded Stacked Applications Multiple can be packaged within the same footprint of a single chip by using Folded Stacked Packaging. Wireless, portable or handheld devices requiring increased functionality in less space Computing and networking application devices requiring densification of memory Features & Benefits Manufacturing Process Applications Technical Papers   HOME   COMPANY   TECHNOLOGIES   SYSTEMS ENGINEERING   INVESTORS   NEWS   CONTACT US © Copyright 2008 Tessera, Inc. All rights reserved. Legal Info | Privacy Policy