Folded Stacked Features and Benefits
Form factor of electronic devices such as an MP3 player can be significantly impacted through the use of folded stacked technology.
- Increased functionality or memory density within the same footprint
- Integration of single- or multiple-sourced die types and/or system-on-chip packages
- Intermediate test and burn-in provides near 100% final package yield
- µBGA® technologies provide design flexibility to utilize wire or lead-bond interconnect technology, polyimide or laminate-based substrates
- Assembly leverages coventional CSP/BGA assembly lines, materials and SMT processes
- Compliant chip technology relieves solder ball stress resulting in high reliability
- Processes are transferable to licensed assemblers to enable multiple sourcing
- 100% lead-free compatible enabling green product design and manufacture
|
|
