Folded Stacked Manufacturing Process
Tessera's Folded Stacked technology utilizes the same manufacturing process as the µBGA. The only modification to the manufacturing process comes at the end of the process, where a folding tool is required.
After the µBGA packages are produced in strip format, they are singulated with the die sites of each package still connected together via the flexible substrate. The folding is performed using a conventional mechanical process, with the folding tool providing the correct temperature for the final adhesive material to cure. The package is then available for handling the same as with any other CSP.
This package can be made to be compatible with conventional testing equipment, and can also be made to have JEDEC Level 1 moisture sensitivity for ease of handling.
Please go to our µBGA section to learn more about our manufacturing process. |
