µZ® MCPs Overview
The trend towards miniaturization continues. Demand for enhanced functionality and increased memory capacity drives the microelectronics industry toward multi-die packaging, in an effort to reduce size, weight, thickness and cost. Most major players in the semiconductor industry offer a multi-chip, System-in-Package (SiP), or System-on-Chip (SoC) solutions; many of the solutions are expensive because the risk is high , the yield is low and significant investment is required. Furthermore, many of the available choices are proprietary or limited in availability which greatly complicates the supply chain.
Tessera developed the µZ® Multi-Chip technology family to resolve technical and business challenges inherent with today's multi-chip or SiP products. Based on Tessera's chip scale packaging expertise, µZ® package solutions are designed to optimize performance and reliability while meeting product space constraints and lowering overall system cost. These versatile solutions incorporate folding and/or stacking processes to combine multiple components from various vendors, and they enable the integration of SoC component as well. Unlike other techniques, no new assembly lines are required; with minimal investment, the CSP/BGA assembly infrastructure and SMT processes are quickly adapted to assemble Tessera's µZ® technology. A practical multi-chip packaging choice is now available which reduces risk and time-to-market, minimizes cost and achieves near 100% final package yield.
Features and Benefits
- Package design flexibility increases functionality or memory density within the same footprint
- Integration at the package level of single- or multiple-sourced die types and/or System-on-Chip packages
- Intermediate test and burn-in provides near 100% final package yield
- µBGA® technologies provide design flexibility to utilize wire or lead-bond interconnect technology, polyimide or laminate-based substrates
- Multi-chip assembly leverages conventional CSP/BGA assembly lines and production processes
- Compliant chip technology relieves solder ball stress resulting in high reliability
- Processes are transferable to licensed assemblers to enable multiple sourcing
- 100% lead-free compatible, enabling green product design and manufacture
If you are interested in our stacked solutions, please contact us at info@tessera.com. |
